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For immediate assistance, please call 1-631-784-6100 (USA)
or our nearest office |
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- Laser processing technology continues to push manufacturing methods forward, giving industry even greater speeds, quality and flexibility - while enabling entirely new techniques and processes to take shape. The multiple advantages of laser processing include throughput, yields, quality, flexibility, cost, accuracy and unique processes.
 The Quantronix Applications Development Center is a state of the art facility designed to accommodate a wide range of laser material processing applications - including marking, engraving, deep engraving and all types of micromachining. Our applications center also offers ultrafast micromachining capabilities, enabling micromachining at the sub-micron levels.
- We have invested in state of the art laboratories that are equipped with a broad spectrum of lasers including ultrafast lasers, marking and deep engraving systems, a variety of multi axis stages, fixed and galvo-based beam delivery systems, gas assist, vision systems, pulse train shapers, other options and accessories. Diagnostic and analytical instruments are utilized for process control, measurement and reporting of results to our customers.
- Our applications center is equipped to provide our customers with the ability to conduct manufacturing simulations. This applications center experiences a high success rate and processes over 1000 customer applications in a year, ranging from simple marking applications to complex sub-micron micromachining.
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- Our goal is to help you to
- "Verify Before You Purchase"
- See what our laser systems can do for your applications
- Select the best laser solution for your process
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| Over time we have built up considerable expertise in a host of material processing fields. If you are considering laser processing for your application please feel free to contact us - there is a high probability that we have already performed similar applications, or perhaps you would like us to perform a FREE feasibility study. |
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